We participated in EFECS 2024, the European Forum for Electronic Components, connecting with industry leaders and innovators in electronics and semiconductor technology.
We are pleased to announce the successful conclusion of the initial WP1 meeting for the Shape Future project. The online gathering served as a platform for outlining key deliverables, assigning responsibilities, and establishing a comprehensive project timeline. We're eager to see the impact of this project and look forward to sharing updates as we progress.
We are pleased to announce the successful conclusion of the initial WP1 meeting for the Shape Future project. The online gathering served as a platform for outlining key deliverables, assigning responsibilities, and establishing a comprehensive project timeline. We're eager to see the impact of this project and look forward to sharing updates as we progress.
The project is supported by the Chips joint Undertaking and its members, including the top-up funding by the national Authorities of Germany, Belgium, Spain, Finland, Netherlands, Austria, Italy, Greece, Latvia, Lithuania and Turkey, under grant agreement number 101139996-2. Co-funded by European Union.
