We participated in EFECS 2024, the European Forum for Electronic Components, connecting with industry leaders and innovators in electronics and semiconductor technology.
The project is supported by the Chips joint Undertaking and its members, including the top-up funding by the national Authorities of Germany, Belgium, Spain, Finland, Netherlands, Austria, Italy, Greece, Latvia, Lithuania and Turkey, under grant agreement number 101139996-2. Co-funded by European Union.
