June 26 2025

ShapeFuture at EFECS 2025

ShapeFuture participated in EFECS 2025, showcasing how the project is advancing semiconductor innovation and supporting Europe's next-generation technology capabilities. The event featured several important project activities, including the ShapeFuture General Assembly, an OEM engagement workshop, and a project presentation delivered by Jochen Koszescha at Booth 18. Discussions focused on strengthening collaboration across the ecosystem and increasing OEM engagement in the development of software-defined vehicle architectures.
Throughout the event, ShapeFuture engaged with stakeholders from across the semiconductor and mobility value chains, highlighting the project's contribution to Europe's competitiveness and technological leadership.

  • SHAPE FUTURE WP1 KICK OFF MEETING

    We are pleased to announce the successful conclusion of the initial WP1 meeting for the Shape Future project. The online gathering served as a platform for outlining key deliverables, assigning responsibilities, and establishing a comprehensive project timeline. We're eager to see the impact of this project and look forward to sharing updates as we progress.
  • We are pleased to announce the successful conclusion of the initial WP1 meeting for the Shape Future project. The online gathering served as a platform for outlining key deliverables, assigning responsibilities, and establishing a comprehensive project timeline. We're eager to see the impact of this project and look forward to sharing updates as we progress.




SHAPE FUTURE PROJECT

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The project is supported by the Chips joint Undertaking and its members, including the top-up funding by the national Authorities of Germany, Belgium, Spain, Finland, Netherlands, Austria, Italy, Greece, Latvia, Lithuania and Turkey, under grant agreement number 101139996-2. Co-funded by European Union.